| Model | N--182 | N--183 | N--210 | N--210R |
| Dimensions (mm) | 182×182±0.3 | 182.2×183.75±0.3 | 210×210±0.3 | 182×210±0.3 |
| Wafer length(mm) | 247±0.25 | 256±0.25 | 295±0.25 | 272±0.25 |
| Thickness (μm) | 130-150 | |||
| EFF | 25.1%-26.2% | |||
The N-Type Mono Silicon Wafer is designed to support high-efficiency, next-generation solar cell technologies. Thanks to its advanced doping structure and high-purity crystal quality, the N-Type Mono Silicon Wafer delivers superior electrical performance and long-term stability compared to conventional wafers.
Higher conversion efficiency
The N-Type Mono Silicon Wafer features lower carrier recombination and longer minority carrier lifetime, enabling higher cell efficiency for TOPCon, HJT, and IBC technologies.
No boron-oxygen degradation
Unlike P-type materials, the N-Type Mono Silicon Wafer is free from LID caused by boron-oxygen complexes, ensuring stable power output over the module lifecycle.
Excellent temperature performance
With a lower temperature coefficient, the N-Type Mono Silicon Wafer maintains stronger energy output in high-temperature and high-irradiance environments.
Superior long-term reliability
The N-Type Mono Silicon Wafer offers strong resistance to LID and LeTID, delivering higher energy yield and reduced performance degradation over time.
Compatible with thin-wafer manufacturing
High mechanical strength and purity allow the N-Type Mono Silicon Wafer to support thinner designs, helping reduce material usage and overall production costs.
With its balance of efficiency, reliability, and scalability, the N-Type Mono Silicon Wafer has become a core material choice for high-performance photovoltaic modules.
| Item | Specification | Inspection Method |
| Electrical resistivity(Ω.cm) | 0.4-1.6 | Wafer inspection system |
| Oxygen content (at/cm³) | ≤6E + 17 | FTIR spectrometer |
| Carbon content(at/cm³) | ≤ 5E + 16 | FTIR spectrometer |
| Minority carrier lifetime(μs) | ≥1000 | Transient with injection level: 5E14 cm-3(Sinton BCT-400 ) |
| Item | Specification | Inspection Method |
| Crystal growth mode | CZ Czochralski Method | — |
| Wafer Type | Mono | preferential etching (ASTMF47-88) |
| Dislocation density(pcs/c㎡) | ≤500 | XRD(ASTM F26-1987) |
| Surface orientation | <100>±3° | XRD(ASTM F26-1987) |
| Lateral orientation | <010>, <001>±3° | XRD(ASTM F26-1987) |