N-Type Mono Silicon Wafer

182/183/210/210R

Technical Advantages
Basic Parameters
Technical Advantages
Luan Soalr N-Type Mono Silicon Wafer
Luan Soalr N-Type Mono Silicon Wafer
Ultra-Low Loss Manufacturing

Ultra-Low Loss Manufacturing

Fine-Wire Cutting Technology: Reduces wire consumption by 15% and increases wafers per ingot by 8%
Smart Chamfering Process: Minimizes edge recombination loss, improving module CTM (Cell-to-Module) efficiency by 1.2%
Universal Platform Compatibility

Universal Platform Compatibility

Supports hybrid designs for 182/210 module platforms
Compatible with bifacial double-glass modules, flexible mounting systems, and other emerging applications
Quality Assurance System

Quality Assurance System

Full-process SPC (Statistical Process Control) ensures wafer breakage rate <0.3%
Each batch includes EL (Electroluminescence) and PL (Photoluminescence) inspection reports
Efficient Service Support

Efficient Service Support

Establish a follow-up mechanism to regularly communicate and understand product usage and customer needs.
Set up a 24-hour customer service hotline to resolve queries anytime, ensuring customers have no worries.
Leading Quality Standards

N-Type Mono Silicon Wafer Core Products Specifications


ModelN--182N--183N--210N--210R
Dimensions (mm)182×182±0.3182.2×183.75±0.3210×210±0.3182×210±0.3
Wafer length(mm)247±0.25256±0.25295±0.25272±0.25
Thickness (μm)130-150
EFF25.1%-26.2%


N-Type Mono Silicon Wafer Core Product Features


The N-Type Mono Silicon Wafer is designed to support high-efficiency, next-generation solar cell technologies. Thanks to its advanced doping structure and high-purity crystal quality, the N-Type Mono Silicon Wafer delivers superior electrical performance and long-term stability compared to conventional wafers.


Key Advantages of N-Type Mono Silicon Wafer


Higher conversion efficiency
The N-Type Mono Silicon Wafer features lower carrier recombination and longer minority carrier lifetime, enabling higher cell efficiency for TOPCon, HJT, and IBC technologies.


No boron-oxygen degradation
Unlike P-type materials, the N-Type Mono Silicon Wafer is free from LID caused by boron-oxygen complexes, ensuring stable power output over the module lifecycle.


Excellent temperature performance
With a lower temperature coefficient, the N-Type Mono Silicon Wafer maintains stronger energy output in high-temperature and high-irradiance environments.


Superior long-term reliability
The N-Type Mono Silicon Wafer offers strong resistance to LID and LeTID, delivering higher energy yield and reduced performance degradation over time.


Compatible with thin-wafer manufacturing
High mechanical strength and purity allow the N-Type Mono Silicon Wafer to support thinner designs, helping reduce material usage and overall production costs.


With its balance of efficiency, reliability, and scalability, the N-Type Mono Silicon Wafer has become a core material choice for high-performance photovoltaic modules.



Basic Parameters
Key Parameter
ItemSpecificationInspection Method
Electrical resistivity(Ω.cm)0.4-1.6Wafer inspection system
Oxygen content (at/cm³)≤6E + 17FTIR spectrometer
Carbon content(at/cm³)≤ 5E + 16FTIR spectrometer
Minority carrier lifetime(μs)≥1000Transient with injection level: 5E14 cm-3(Sinton BCT-400 )



Material Property
ItemSpecificationInspection Method
Crystal growth modeCZ Czochralski Method
Wafer TypeMonopreferential etching (ASTMF47-88)
Dislocation density(pcs/c㎡) ≤500XRD(ASTM F26-1987)
Surface orientation<100>±3°XRD(ASTM F26-1987)
Lateral orientation<010>, <001>±3°XRD(ASTM F26-1987)



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